Modeling effect of chemical-mechanical synergy on material removal at molecular scale in chemical mechanical polishing

Wear

Volumn 265, Issue 5-6, 2008, Pages 721-728

  Wang, Yongguang ^a   Zhao, Yongwu ^a   Jiang, Jianzhong ^a   Li, Xufang ^a   bai, Jing ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

Chemical mechanical synergistic effects; CMP; Model; Molecular scale

Indexed keywords

CONCENTRATION (PROCESS); MATHEMATICAL MODELS; PARAMETER ESTIMATION; POLISHING;

CHEMICAL-MECHANICAL SYNERGISTIC EFFECTS; MOLECULAR SCALE;

MOLECULAR STRUCTURE;

CONCENTRATION (PROCESS); MATHEMATICAL MODELS; MOLECULAR STRUCTURE; PARAMETER ESTIMATION; POLISHING;

EID: 43549126889     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2008.01.001     Document Type: Article

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