Catalytic-Pad Chemical Kinetics Model of CMP

Electrochemical and Solid-State Letters

Volumn 6, Issue 12, 2003, Pages

  Chen, Ping Hsun ^a   Shih, Han C ^a   Huang, Bing Wei ^a   Hsu, Jyh Wei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; DISSOLUTION; PARTICLE SIZE ANALYSIS; REACTION KINETICS; SHEAR STRESS; SLURRIES;

CATALYTIC PAD; POLISHING RATE (PR);

CHEMICAL MECHANICAL POLISHING;

EID: 0344083604     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1621832     Document Type: Article

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