Advances in research and application of lead-free solders for electronic and photonic packaging

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research

Volumn 22, Issue 1, 2008, Pages 1-9

  Zhang, Xinping ^a   Yin, Limeng ^a   Yu, Chuanbao ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electromigration; Electronic and photonic packaging; Lead free solders; Metallic materials; Reliability; Tin whisker

Indexed keywords

COPPER ALLOYS; DURABILITY; ELECTROMIGRATION; PACKAGING; RELIABILITY; SILVER ALLOYS; TIN ALLOYS; ZINC ALLOYS;

ELECTRONIC PACKAGING; LEAD FREE SOLDERS; PHOTONIC PACKAGING; TIN WHISKER;

SOLDERING ALLOYS;

EID: 40949105148     PISSN: 10053093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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