Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 2, 2007, Pages 1-4

  Zhang, Xinping ^a   Yu, Chuanbao ^a   Zhang, Yupeng ^a   Zhu, Min ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Creep behavior; Intergranular fracture; Lead free solder; Mechanical properties; Transgranular fracture

Indexed keywords

CREEP RESISTANCE; FRACTURE; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

CREEP BEHAVIOR; INTERGRANULAR FRACTURE; LEAD FREE SOLDER; TRANSGRANULAR FRACTURE;

SOLDERING ALLOYS;

EID: 34147194578     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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