Present status of transition to Pb-free soldering

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005

Volumn 2005, Issue , 2005, Pages 72-77

  Illyefalvi Vitez Zs ^a   Pinkola, J ^a   Harsanyi G ^a   Dominkovics, Cs ^a   Illes B ^a   Tersztyanszky L ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; ELECTRONICS INDUSTRY; LEAD; NITROGEN; PHASE TRANSITIONS; SOLDERED JOINTS;

LEAD-FREE ALLOYS; LEAD-FREE TECHNOLOGY; SMALL AND MEDIUM-SIZE ENTERPRISES (SMES); SOLDERING EQUIPMENT;

SOLDERING;

EID: 33745476079     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2005.1491006     Document Type: Conference Paper

References (11)

1. Directive 2002/95/EC of the European Parliament and Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
2. Directive 2002/96/EC of the European Parliament and Council on waste electrical and electronic equipment (WEEE)
3. SOLDERTEC European Lead-free Technology Roadmap, Soldertec website at www.lead-free.org
4. IPC Roadmap: A guide for assembly of lead-free electronics, from www.lead-free.org
5. Will the Real Immersion Silver Please Stand Up! Free Forum at IPC Printed Circuits Expo 2004, Anaheim, California, February 24th, 2004
6. NoNE lead-free soldering guideline, Nordic Industrial Fund, Version 1-20021223
7. LF300 Lead-free, No-Clean Solder Paste Engineers' Manual; Product specifications, Applications notes and test reports; Document Ref MSL813 03/03; www.loctite.com
8. Vitronies Soltec Company: 5 Steps to Lead-free Soldering, CD-ROM supplement of EPP Magazine, September 2004
9. th November 2004
10. Jürgen Friedrich: Lead-free Wave Soldering Microsolder Seminar, Budapest, Hungary, 4 November 2004
11. th November 2004