The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth

Microelectronics Reliability

Volumn 47, Issue 1, 2007, Pages 88-92

  Fukuda, Yuki ^a   Osterman, Michael ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DEFORMATION; ELECTRIC CURRENTS; RAPID THERMAL ANNEALING; STATISTICAL METHODS;

DESIGN-OF-EXPERIMENT ASSESSMENT; DISTRIBUTION-BASED DATA; MATTE TIN-PLATED COPPER;

CRYSTAL GROWTH;

EID: 33845383438     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.04.011     Document Type: Article

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