SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 333, Issue 1-2, 2002, Pages 45-50

Fluxless In-Sn bonding process at 140 °C

(2) Lee, Chin C a Choe, Selah a

a University of California at Irvine (United States)

Author keywords

Bonding; Eutectic; Fluxless; Indium; Solder; Tin

Indexed keywords

COMPOSITE MATERIALS; DUCTILITY; ELECTRONICS PACKAGING; EUTECTICS; FLUXES; INDIUM; MICROSTRUCTURE; MULTILAYERS; OXIDATION; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; TIN;

FLUXLESS BONDING;

SOLDERING;

BOND STRENGTH; DUCTILITY; FLUX; INDIUM; TIN; WELD;

EID: 0036680628 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-5093(01)01815-9 Document Type: Article

Times cited : (46)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.