Die attachment for -120°C to +20°C thermal cycling of microelectronics for future Mars rovers - An overview

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 105-111

  Kirschman, Randall K ^a   Sokolowski, Witold M ^a   Kolawa, Elizabeth A ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041905257     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1347996     Document Type: Article

References (63)

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