Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 1, 2006, Pages 158-163

  Wu, Wen Yun ^a   Qiu, Xiao Ming ^a   Yin, Shi Qiang ^a   Sun, Da Qian ^a   Li, Ming Gao ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Mechanical properties; Microstructure; Sn Zn lead free solder; Wettability

Indexed keywords

BISMUTH; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; PLASTICITY; PRECIPITATION (CHEMICAL); SHEAR STRENGTH; SILVER; SOLDERED JOINTS; TIN; ZINC;

ELONGATION; LEAD FREE SOLDER; SOLDER SYSTEM; WETTABILITY;

SOLDERING ALLOYS;

EID: 33646750384     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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