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Materials Science and Engineering: A

Volumn 409, Issue 1-2, 2005, Pages 131-139

Spontaneous whisker growth on lead-free solder finishes

(2) Tu, K N a Li, J C M b

a UNIVERSITY OF CALIFORNIA (United States)

b University of Rochester (United States)

Author keywords

Beta Sn; Lead free solder; Whisker growth

Indexed keywords

COMPRESSIVE STRENGTH; CREEP; CRYSTAL WHISKERS; FLOW OF FLUIDS; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; TEMPERATURE; TIN; X RAY DIFFRACTION ANALYSIS;

CREEP BEHAVIOR; LEAD-FREE SOLDER; WHISKER GROWTH;

SOLDERING ALLOYS;

SOLDER;

EID: 28544453331 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.06.074 Document Type: Article

Times cited : (186)

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