The future of microelectronics and photonics and the role of mechanics and materials

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 11-

  Suhir, E ^a  

^a NONE

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Indexed keywords

EID: 85025220432     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792280     Document Type: Editorial

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