Electro-thermal actuator for on-chip nanoscale tensile tests: Analytical modelling and multi-physics simulations

Sensor Letters

Volumn 5, Issue 3-4, 2007, Pages 592-607

  Corigliano, Alberto ^a   Domenella, Livio ^a   Espinosa, Horacio D ^b   Zhu, Yong ^b  

^a POLITECNICO DI MILANO   (Italy)

^b Northwestern University   (United States)

Author keywords

Analytical model; Electro thermal mechanical actuator; Multi physics finite element simulations

Indexed keywords

CARBON NANOTUBES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NANOWIRES; TEMPERATURE MEASUREMENT; TENSILE TESTING; THIN FILMS;

ANALYTICAL MODEL; ELECTRO-THERMAL ACTUATOR; MULTI-PHYSICS SIMULATIONS; ON-CHIP NANOSCALE TENSILE TESTS;

ACTUATORS;

EID: 37349020797     PISSN: 1546198X     EISSN: None     Source Type: Journal    
DOI: 10.1166/sl.2007.241     Document Type: Article

References (37)

1. J. W. Gardner, V. K. Varadan, and O. O. Awadelkarim, Microsensors MEMS and Smart Devices, Wiley, Chichester (2001).
2. S. E. Lyshevski, MEMS and NEMS, Systems Devices and Structures, CRC Press, Boca Raton (2002).
3. F. Cacchione, A. Corigliano, B. De Masi, and C. Riva, Microelectronics Reliability 45, 1758 (2005).
4. F. Cacchione, B. De Masi, A. Corigliano, and M. Ferrera, Sensor Letters 4, 38 (2006).
5. A. Corigliano, B. De Masi, A. Frangi, C. Comi, A. Villa, and M. Marchi, J. Microelectromech. Syst. 13, 200 (2004).
6. M. A. Haque and M. T. A. Saif, Proceedings National Ac. of Sciences USA (2004), Vol. 101, p. 6335.
7. H. Kahn, R. Ballarini, R. L. Mullen, and A. H. Heuer, Proceedings Royal Society London Series A-Math. Phys. Eng. Sciences (1999), Vol. 455, p. 3807.
8. H. Kapels, R. Aigner, and J. Binder, IEEE T. Electron Dev. 47, 1522 (2000).
9. W. W. Van Arsdell and S. B. Brown, J. Microelectromech. Systems 8, 319 (1999).
10. I. Chasiotis and W. G. Knauss, J. Mech. Phys. Solids 51, 1533 (2003).
11. W. N. Sharpe, Jr., K. M. Jackson, K. J. Hemker, and Z. Xie, J. Microelectromech. Syst. 10, 317 (2001).
12. Y. Zhu, C. Ke, and H. D. Espinosa, Experimental Mechanics 47, 7 (2007).
13. Y. Zhu, N. Moldovan, and H. D. Espinosa, Appl. Phys. Lett. 86, 013506 (2005).
14. R. S. Chen, C. Kung, and G. B. Lee, J. Micromechanics and Microengineering 12, 291 (2002).
15. L. L. Chu and Y. B. Gianchandani, J. Micromech. Microeng. 13, 279 (2003).
16. J. H. Comtois, M. A. Michalicek, and C. Barron, Sens. Actuators, A 70, 23 (1998).
17. E. T. Enikov, S. S. Kedar, and K. V. Lazarov, J. Microelectromech. Syst. 14, 788 (2005).
18. A. A. Geisberger, N. Sarkar, M. Ellis, and G. Skidmore, J. Microelectromech. Syst. 12, 513 (2003).
19. Y. B. Gianchandani and K. Najafi, J. Microelectromech. Syst. 5, 52 (1996).
20. Q. Huang and N. Lee, J. Micromech. Microeng. 9, 64 (1999).
21. S. P. Kearney, L. M. Phinney, and M. S. Baker, J. Microelectromech. Syst. 15, 314 (2006).
22. G. B. Lee, R. S. Chen, and C. J. Kung, J. of Chinese Society of Mechanical Engineering 23, 155 (2002).
23. C. D. Lott, T. W. Mc Lain, J. N. Harb, and L. L. Howell, Sens. Actuators, A 101, 239 (2002).
24. N. D. Mankame and G. K. Ananthasuresh, J. Micromech. Microeng. 11, 452 (2001).
25. M. Pai and N. C. Tien, Sensors and Actuators 83, 237 (2000).
26. J. S. Park, L. L. Chu, A. D. Oliver, and Y. B. Gianchandani, J. Microelectromech. Syst. 10, 255 (2001).
27. L. Que, J. S. Park, and Y. B. Gianchandani, J. Microelectromech. Syst. 10, 247 (2001).
28. A. Atre, J. Micromech. Microeng. 16, 205 (2006).
29. Y. Zhu, A. Corigliano, and H. D. Espinosa, J. Micromech. Microeng. 16, 242 (2006).
30. Y. Zhu and H. D. Espinosa, Proc. Natl. Acad. Sci. USA (2005), Vol. 102, p. 14503.
31. F. P. Incropera and D. P. Dewitt, Fundamentals of Heat and Mass Transfer, John Wiley & Sons, INC (1996).
32. F. J. Suriano and K. T. Yang, Int. J. of Heat and Mass Transfer 11, 473 (1968).
33. A. Jacquot, W. L. Liu, G. Chen, J.-P Fleurial, A. Dauscher, and B. Lenoir, Thermoelectrics, Proceedings ICT '02 (2002), Vol. 25, p. 118.
34. H. Watanabe, M. Susa, H. Fukuyama, and K. Nagata, High Temperatures-High Pressures 31, 587 (1999).
35. M. Chiao and L. Lin, IEEE J. Microelectromechanical Systems 9, 146 (2000).
36. N. W. Ashcroft and N. D. Mermin, Solid State Physics, Brooks/Cole (1976).
37. MUMPs web, http://www.memsrus.com/