Analysis and design of polysilicon thermal flexure actuator

Journal of Micromechanics and Microengineering

Volumn 9, Issue 1, 1999, Pages 64-70

  Huang, Qing An ^a,b   Lee, Neville Ka Shek ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SOUTHEAST UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTICITY; ELECTRONIC EQUIPMENT TESTING; HEAT CONDUCTION; HEAT LOSSES; HEAT RADIATION; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; SEMICONDUCTING SILICON; TEMPERATURE; THERMOANALYSIS;

CONDUCTION HEAT LOSSES; ELECTROTHERMAL ANALYSIS; POLYSILICON THERMAL FLEXURE ACTUATOR;

MICROACTUATORS;

EID: 0033096840     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/9/1/308     Document Type: Article

References (10)

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