Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)- disulfide (SPS)

Electrochimica Acta

Volumn 50, Issue 16-17, 2005, Pages 3563-3568

  Lee, Chang Hwa ^a   Lee, Sang Chul ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

Additive; Bottom up filling; Cu electroless deposition; QCM; SPS

Indexed keywords

ADSORPTION; CONCENTRATION (PROCESS); COPPER COMPOUNDS; CURRENT DENSITY; GRAVIMETRIC ANALYSIS; IMPURITIES; QUARTZ APPLICATIONS; SULFUR COMPOUNDS; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

ADDITIVE; BIS-(3-SULFOPROPYL)-DISULFIDE (SPS); BOTTOM-UP FILLING; CU ELECTROLESS DEPOSITION; QUARTZ CRYSTAL MICROBALANCE (QCM);

ELECTROLESS PLATING;

EID: 18544366704     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.01.009     Document Type: Article

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