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Journal of Applied Electrochemistry

Volumn 34, Issue 3, 2004, Pages 291-300

Integration of thin electroless copper films in copper interconnect metallization

(4) Webb, E a Witt, C b Andryuschenko, T a Reid, J a

a Novellus Systems Inc (United States)

b SEMATECH (United States)

Author keywords

Copper; Electroless; Electroplating; Interconnect; Seed repair

Indexed keywords

CHEMICAL BONDS; COMPRESSIVE STRESS; COPPER; ELECTROLESS PLATING; ELECTROPLATING; FORMALDEHYDE; METALLIZING; ORGANIC ACIDS; PHYSICAL VAPOR DEPOSITION; POLYETHYLENE GLYCOLS; SCANNING ELECTRON MICROSCOPY;

ELECTROLESS; INTERCONNECT; SEED REPAIR;

THIN FILMS;

EID: 1542786241 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/B:JACH.0000015618.02583.f7 Document Type: Article

Times cited : (20)

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