Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives

Electrochemical and Solid-State Letters

Volumn 9, Issue 8, 2006, Pages

  Hasegawa, Madoka ^a   Okinaka, Yutaka ^a,c   Shacham Diamand, Yosi ^b   Osaka, Tetsuya ^a,c  

^a WASEDA UNIVERSITY   (Japan)

^b TEL AVIV UNIVERSITY   (Israel)

^c ELECTROCHEMICAL SOCIETY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS COPPER DEPOSITION; SULFONIC ACID; TRENCH BOTTOM; VOIDS;

CONCENTRATION (PROCESS); DEPOSITION; ELECTROLESS PLATING; POLYETHYLENE GLYCOLS; SOLID STATE PHYSICS; SUBSTRATES;

COPPER;

EID: 33745399140     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2206008     Document Type: Article

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