Improvement of electrolessly gap-filled Cu using 2,2′-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS)

Electrochemical and Solid-State Letters

Volumn 8, Issue 8, 2005, Pages

  Lee, Chang Hwa ^a   Lee, Sang Chul ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DEPOSITION; ELECTRIC PROPERTIES; SURFACE ROUGHNESS; THIN FILMS;

BIS(3-SULFOPROPYL) DISULFIDE (SPS); BOTTOM-UP FILLING BEHAVIOR; FILM RESISTIVITY;

ELECTROLESS PLATING;

EID: 24344437084     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1943551     Document Type: Article

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