Optimization of a pretreatment for copper electroless deposition on Ta substrates

Journal of the Electrochemical Society

Volumn 154, Issue 3, 2007, Pages

  Lee, Chang Hwa ^a   Cha, Seung Hwan ^b   Kim, Ae Rim ^a   Hong, Ji Ho ^c   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b LG Display Co Ltd   (South Korea)

^c Dongbu Hannong Chemical Co   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ANNEALING; COALESCENCE; ELECTROLESS PLATING; SUBSTRATES; TANTALUM; X RAY PHOTOELECTRON SPECTROSCOPY;

ACTIVATION TIME; CHRONOPOTENTIOMETRY; FILM FORMATION; NATIVE OXIDES;

COPPER;

EID: 33846989025     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2432074     Document Type: Article

References (26)

1. Y. Shacham-Diamand and Y. Sverdlov, Microelectron. Eng., 50, 525 (2000).
2. S. Guan and B. J. Nelson, Sens. Actuators, A, 118, 307 (2005).
3. J. E. Gray, P. R. Norton, R. Alnouno, C. L. Marola, M. A. Valvano, and K. Griffiths, Biomaterials, 24, 2759 (2003).
4. M. E. Gertner and M. Schlesingers, Electrochem. Solid-State Lett., 6, J4 (2003).
5. C. Fukuhara, H. Ohkura, Y. Kamata, Y. Murakami, and A. Igarashi, Appl. Catal., A, 273, 125 (2004).
6. H. Sun, G. Sun, S. Wang, J. Liu, X. Zhao, G. Wang, H. Xu, S. Hou, and Q. Xin, J. Membr. Sci., 259, 27 (2005).
7. C. H. Lee, S. C. Lee, and J. J. Kim, Electrochem. Solid-State Lett., 8, C110 (2005).
8. C. H. Lee, S. K. Cho, and J. J. Kim, Electrochem. Solid-State Lett., 8, J27 (2005).
9. A. Bauer, J. Ganz, K. Hesse, and K. Köhler, Appl. Surf. Sci., 46, 113 (1990).
10. H. M. Cheng, B. L. Zhou, Z. G. Zheng, Z. M. Wang, and C. X. Shi, Plat. Surf. Finish., 77, 130 (1990).
11. J. J. Kim and S. H. Cha, Jpn. J. Appl. Phys., Part 1, 41, L1269 (2002).
12. M. Charbonnier, M. Alami, and M. Romand, J. Electrochem. Soc., 143, 472 (1996).
13. J. J. Kim and S. H. Cha, Jpn. J. Appl. Phys., Part 1, 40, 7151 (2001).
14. S.-Y. Chang, C.-J. Hsu, R.-H. Fang, and S.-J. Lin, J. Electrochem. Soc., 150, C603 (2003).
15. W.-T. Tseng, C.-H. Lo, and S.-C. Lee, J. Electrochem. Soc., 148, C327 (2001).
16. H.-H. Hsu, C.-W. Teng, S.-J. Lin, and J.-W. Yeh, J. Electrochem. Soc., 149, C143 (2002).
17. A. E. Kaloyeros and E. Eisenbraun, Annu. Rev. Mater. Sci., 30, 363 (2000).
18. Binary Phase Diagram, T. B. Massalski, Editor, ASM International, Materials Park, OH (1990).
19. M. Takeyama, A. Noya, and A. Ohta, J. Vac. Sci. Technol. B, 14, 3263 (1996).
20. B. Luanm, M. Yeung, W. Wells, and X. Liu, Appl. Surf. Sci., 156, 26 (2000).
21. W. E. Campbell and U. B. Thomas, Trans. Electrochem. Soc., 76, 303 (1939).
22. J. J. Kim and S.-K. Kim, Appl. Surf. Sci., 183, 311 (2001).
23. Q.-Y. Tong, Q. Gan, G. Fountain, P. Enquist, R. Scholz, and U. Gösele, Appl. Phys. Lett., 85, 3731 (2004).
24. S. Sapra, H. Li, Z. Wang, and I. I. Suni, J. Electrochem. Soc., 152, B193 (2005).
25. S. Siau, A. Vervaet, E. Schacht, and A. V. Calster, J. Electrochem. Soc., 151, C133 (2004).
26. C. H. Lee, S. Hwang, S.-C. Kim, and J. J. Kim, Electrochem. Solid-State Lett., 9, C157 (2006).