Electroless Cu bottom-up filling using 3-N,N-dimethylaminodithiocarbamoyl- 1-propanesulfonic acid

Electrochemical and Solid-State Letters

Volumn 8, Issue 11, 2005, Pages

  Lee, Chang Hwa ^a   Cho, Sung Ki ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); COPPER COMPOUNDS; DIFFUSION; ELECTROLESS PLATING; MORPHOLOGY; PROPANE; SURFACES;

PLANAR SURFACE; SULFONIC ACID; SUPPRESSING EFFECTS;

ORGANIC ACIDS;

EID: 27744434000     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2063291     Document Type: Article

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