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Applied Surface Science

Volumn 183, Issue 3-4, 2001, Pages 311-318

Optimized surface pretreatments for copper electroplating

(2) Kim, Jae Jeong a Kim, Soo Kil a

a Seoul National University (South Korea)

Author keywords

Copper; Coulometric reduction; Electroplating; Oxide; Pretreatment; Wet cleaning

Indexed keywords

ATOMIC FORCE MICROSCOPY; COULOMETERS; ELECTROPLATING; ETCHING; REDUCTION; SPUTTER DEPOSITION; SURFACE TREATMENT;

COULOMETRIC REDUCTIONS;

COPPER;

EID: 0035965602 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/S0169-4332(01)00585-2 Document Type: Article

Times cited : (42)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.