Pattern density effect on the bottom-up fill during damascene copper electrodeposition

Electrochemical and Solid-State Letters

Volumn 10, Issue 6, 2007, Pages 55-59

  Akolkar, Rohan ^a   Dubin, Valery ^a,b  

^a INTEL CORPORATION   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADSORPTION; CONCENTRATION (PROCESS); ELECTRODEPOSITION; MATHEMATICAL MODELS; METALLIZING;

ADDITIVE CONCENTRATION; CONCENTRATION DISTRIBUTION; CRITICAL DIMENSION (CD); PATTERN DENSITY;

COPPER;

EID: 34047275746     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2717364     Document Type: Article

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