Gap-filling capability and adhesion strength of the electroless-plated copper for submicron interconnect metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 2, 2002, Pages 561-565

  Lin, Jian Hong ^a   Hsieh, Wei Jen ^a   Hsu, Jyh Wei ^a   Liu, Xein Wien ^a   Chen, Uei Shin ^a   Shih, Han C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CATALYSTS; INDUCTIVELY COUPLED PLASMA; ION IMPLANTATION; IONIZATION; METALLIZING; MULTILAYERS; PLATING;

OPTICAL EMISSION SPECTROMETERS;

COPPER;

EID: 0036505109     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1453456     Document Type: Article

References (16)