LF55GN photosensitive flexopolymer: A new material for ultrathick and high-aspect-ratio MEMS fabrication

Journal of Microelectromechanical Systems

Volumn 16, Issue 3, 2007, Pages 564-570

  Sayah, Abdeljalil ^a   Parashar, Virendra K ^a   Gijs, Martin A M ^a  

^a EPFL   (Switzerland)

Author keywords

Casting; Flexopolymer; High aspect ratio; LF55GN; Microfabrication

Indexed keywords

ASPECT RATIO; DEFORMATION; MICROFABRICATION; MICROSTRUCTURE; PHOTORESISTS; PHOTOSENSITIVITY; PLASTICS CASTING;

HIGH ASPECT RATIO; MEMS FABRICATION; PHOTOSENSITIVE FLEXOPOLYMER;

MEMS;

EID: 34547746046     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.896705     Document Type: Article

References (34)

1. T. Kohlmeier, V. Seidemann, S. Büttgenbach, and H. Gatzen, "An investigation on technologies to fabricate microcoils for miniaturized actuator systems," Microsyst. Technol., vol. 10, no. 3, pp. 175-181, Mar. 2004.
2. T. F. Yen, K. J. Chang, and K. F. Chiu, "Profile control in high aspect ratio contact hole etching by a capacitively coupled plasma source," Microelectron. Eng., vol. 82, no. 2, pp. 129-135, Oct. 2005.
3. R. Engelke, G. Engelmann, G. Gruetzner, M. Heinrich, M. Kubenz, and H. Mischke, "Complete 3D UV microfabrication technology on strongly sloping topography substrates using epoxy photoresist SU-8," Microelectron. Eng., vol. 73/74, no. 1, pp. 456-462, 2004.
4. E. H. Conradie and D. F. Moore, "SU-8 thick photoresist processing as a functional material for MEMS applications," J. Micromech. Microeng. vol. 12, no. 4, pp. 368-374, Jul. 2002.
5. G. Baumeister, K. Mueller, R. Rupercht, and J. Hausselt, "Production of metallic high aspect ratio microstructures by microcasting," Microsyst. Technol., vol. 8, no. 2/3, pp. 105-108, May 2002.
6. J. Müller, "MEMS on silicon for integrated optic metrology and communication systems," Microsyst. Technol., vol. 9, no. 5, pp. 308-315, May 2003.
7. W. Qu, C. Wenzel, and A. Jahn, "One-mask procedure for the fabrication of movable high aspect-ratio 3D microstructures," J. Micromech. Microeng., vol. 8, no. 4, pp. 279-283, Dec. 1998.
8. F. Pérennés, M. Ghigo, M. Tormen, and S. Cabrini, "Production of identical pyramid wavefront sensors for multi-conjugate adaptive optic systems using LIGA process," Microsyst. Technol., vol. 10, no. 6/7, pp. 552-555, Oct. 2004.
9. C. H. Lin, G. B. Lee, B. W. Chang, and G. L. Chang, "A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist," J. Micromech. Microeng., vol. 12, no. 5, pp. 590-597, Sep. 2002.
10. Y. C. Chan, Y. K. Lee, and Y. Zohar, "High-throughput design and fabrication of an integrated microsystem with high aspect-ratio-sub-micro pillar arrays for free-solution micro capillary electrophoresis," J. Micromech. Microeng., vol. 16, no. 4, pp. 699-707, Apr. 2006.
11. A. C. F. Hoole, M. E. Welland, and A. N. Broers, "Negative PMMA as a high resolution resist - The limits and possibilities," Semicond. Sci. Technol., vol. 12, no. 9, pp. 1166-1170, 1997.
12. S. K. Griffiths, J. A. W. Crowell, B. L. Kistler, and A. S. Dryden, "Dimensional errors in LIGA-produced metal structures due to thermal expansion and swelling of PMMA," J. Micromech. Microeng., vol. 14, no. 11, pp. 1548-1557, Nov. 2004.
13. C. C. Zhang, C. S. Yang, and D. F. Ding, "Deep reactive ion etching of PMMA," Appl. Surf. Sci., vol. 227, no. 1-4, pp. 139-143, Apr. 2004.
14. J. T. Kim, S. P. Han, and M. Y. Jeong, "A modified DXRL process for fabricating a polymer microstructure," J. Micromech. Microeng., vol. 14, no. 2, pp. 256-262, Feb. 2004.
15. Z. Liu, F. Bouamrane, M. Roulliay, R. K. Kupka, A. Labèque, and S. Megtert, "Resist dissolution rate and inclined-wall structures in deep X-ray lithography," J. Micromech. Microeng., vol. 14, no. 4, pp. 256-262, Dec. 2004.
16. H. Lorenz, M. Despont, N. Fahrni, J. Brugger, P. Vettiger, and P. Renaud, "High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS," Sens. Actuators A, Phys. vol. 64, no. 1, pp. 33-39, Jan. 1998.
17. V. Seidemann, J. Rabe, M. Feldmann, and S. Büttgenbach, "SU8-micromechanical structures with in situ fabricated movable parts," Microsyst. Technol., vol. 8, no. 4/5, pp. 348-350, Aug. 2002.
18. J. Liu, B. Cai, J. Zhu, G. Ding, X. Zhao, C. Yang, and D. Chen, "Process research of high aspect ratio microstructure using SU-8 resist," Microsyst. Technol., vol. 10, no. 4, pp. 265-268, May 2004.
19. K. Jiang, M. J. Lancaster, I. Llamas-Carro, and P. Jin, "SU-8 Ka-band filter and its microfabrication," J. Micromech. Microeng., vol. 15, no. 8, pp. 1522-1526, Aug. 2005.
20. J. D. Williams and W. J. Wang, "Study on the postbaking process and the effects on the UV lithography of high aspect ratio SU-8 microstructures," J. Microlithogr. Microf. Microsyst., vol. 3, no. 4, pp. 563-568, Oct. 2004.
21. G. Liu, Y. Tian, and Y. Kan, "Fabrication of high aspect-ratio microstructures using SU-8 photoresist," Microsyst. Technol., vol. 11, no. 4, pp. 343-346, Apr. 2005.
22. K. Y. Lee, N. LaBianca, S. A. Rishton, S. Zolgharnain, J. D. Gelorme, J. Shaw, and T. H. P. Chang, "Micromachining applications of high resolution ultrathick photoresist," J. Vac. Sci. Technol. B, Microelectron. Process. Phenom., vol. 13, no. 6, pp. 3012-3016, Nov. 1995.
23. V. Conédéra, B. Le Goff, and N. Fabre, "Potentialities of a new positive photoresist for the realization of thick moulds," J. Micromech. Microeng., vol. 9, no. 2, pp. 173-175, Jun. 1999.
24. G. W. Hsieh, Y. S. Hseih, C. R. Yang, and Y. D. Lee, "Novel positivetone thick photoresist for high aspect ratio microsystem technology," Microsyst. Technol., vol. 8, no. 4/5, pp. 326-329, Aug. 2002.
25. B. E. J. Alderman, C. M. Mann, M. L. Oldfield, and J. M. Chambelain, "An embedded mask for application in high frequency integrated circuits using UV positive resist technology," J. Micromech. Microeng., vol. 10, no. 3, pp. 334-336, Sep. 2000.
26. F. G. Tseng and C. S. Yu, "High aspect ratio ultrathick micro stencil by JSR THB-430N negative UV photoresist," Sens. Actuators A, Phys. vol. 97, no. 8, pp. 764-770, Apr. 2002.
27. B. Loechel, R. Demmeler, M. Rothe, W. Brunerger, S. Fehlberg, and G. Gruetzner, "Application of optical lithography for high aspect ratio microstructures," J. Vac. Sci. Technol. B, Chem., vol. 14, no. 6, pp. 4179-4182, 1996.
28. S. Roth, L. Dellmann, G. A. Racine, and N. F. de Rooij, "High aspect ratio UV photolithography for electroplated structures," J. Micromech. Microeng., vol. 9, no. 2, pp. 105-108, 1999.
29. J. D. Williams and W. Wang, "Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography," Microsyst. Technol., vol. 10, no. 10, pp. 694-698, Dec. 2004.
30. A. Sayah, V. K. Parashar, A. G. Pawlowski, and M. A. M. Gijs, "Elastomer mask for powder blasting microfabrication," Sens. Actuators A, Phys., vol. 125, no. 1, pp. 84-90, Oct. 2005.
31. R. J. Kumpfmiller, "Aqueous developable photosensitive polyurethane-methacrylate," U.S. Patent 6 423 472, Jul. 23, 2002.
32. D. Leach, "Photosensitive resin composition useful in fabricating printing plates," U.S. Patent 6 214 522, Apr. 10, 2001.
33. G. Xu and W. Shi, "Synthesis and characterization of hyperbranched polyurethane acrylates used as UV curable oligomers for coatings," Prog. Org. Coat., vol. 52, no. 2, pp. 110-117, Feb. 2005.
34. P. Barbeau, J. F. Gerard, B. Magny, J. P. Pascault, and G. Vigier, "Morphological analysis of photocured polyurethane acrylate networks. Correlation with viscoelastic properties," J. Polym. Sci., Part B, Polym. Phys., vol. 37, no. 9, pp. 919-937, May 1999.