Potentialities of a new positive photoresist for the realization of thick moulds

Journal of Micromechanics and Microengineering

Volumn 9, Issue 2, 1999, Pages 173-175

  Conedera V ^a   Le Goff, B ^b   Fabre, N ^a  

^a LAAS CNRS   (France)

^b SÜD CHEMIE AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

OPTICAL GLASS; OPTICAL VARIABLES MEASUREMENT; OPTIMIZATION; PHOTOELECTRIC CELLS; PHOTORESISTS; THICK FILMS; TRANSPARENCY;

CLARIANT PHOTORESISTS; MASK ALIGNER; THICK MOULDS; THICKNESS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033138327     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/9/2/317     Document Type: Article

References (7)

1. Conédéra V, Fabre N and Dilhan M 1997 A simple optical system to optimize a high depth to width aspect ratio applied to a positive photoresist lithography process J. Micromech. Microeng.
2. Harmening M, Bacher W, Bley P, Kholi A, Kalb H, Kowanz B, Michel A and Mohr J 1992 MEMS'92 (Travemünd, 1992) pp 4-7
3. Lorentz H, Despont M, Fahrni N, La Bianca N, Renaud P and Wettiger P 1996 MME'96 Micromechanics Europe (Barcelona, 1996)
4. Lorentz H, Despont M, Vettiger P and Renaud P 1998 Fabrication of photoplastic high aspect ratio microparts and micromoulds using SU-8 UV resist Microsyst. Technol. 4 143-6
5. Cullmann E, Lochel B, Mauossek A and Rothe M 1995 Advanced resist processing for thick photoresist applications Microelectronic Engineering 1995, MME'94 Contribution (Aix-en-Provence, 1995)
6. Engelmann G and Reichl H 1992 High depth to width aspect ratios in thick positive photoresist layers using near UV lithography Microelectron. Eng. 17 303-6
7. Honma H and Hagiwara K 1995 Fabrication of gold bumps using gold sulfite plating J. Electrochem. Soc. 142