SU-8 thick photoresist processing as a functional material for MEMS applications

Journal of Micromechanics and Microengineering

Volumn 12, Issue 4, 2002, Pages 368-374

  Conradie, Ewan H ^a   Moore, David F ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CANTILEVER BEAMS; COMPUTER SIMULATION; IMPACT TESTING; MICROELECTRONIC PROCESSING; MICROMACHINING; NATURAL FREQUENCIES; PHOTORESISTS; SCANNING ELECTRON MICROSCOPY; SILICON ON INSULATOR TECHNOLOGY; STRENGTH OF MATERIALS; THREE DIMENSIONAL;

CANTILEVER STRUCTURE; SOFTWARE PACKAGE ABAQUS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036646187     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/4/303     Document Type: Article

References (13)

1. High-aspect-ratio, ultrathick, negative-tone near UV photoresist and its applications for MEMS
2. Simple and low cost fabrication of embedded microchannels by using a new thick-film photoplastic
3. 3D microfabrication by combining microstereolithography and thick UV lithography
4. Application and investigation of in-plane compliant SU-8 structures for MEMS
5. Advanced photoresist technologies for MST
6. SU-8: A low cost negative resist for MEMS
7. Mechanical characterisation of a new high-aspect-ratio near UV resist
8. Polymerisation optimisation of SU-8 photoresist and its applications in microfluidic systems and MEMS
9. A system for automated electrical and optical characterisation of microelectromechanical devices