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Volumn 64, Issue 1, 1998, Pages 33-39

High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS

Author keywords

Electroplating; High aspect ratio; LIGA type applications; Near UV photoresists; Negative tone; Photoplastic

Indexed keywords

ASPECT RATIO; ELECTROPLATING; FABRICATION; MICROELECTROMECHANICAL DEVICES;

EID: 0031674888     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)80055-1     Document Type: Article
Times cited : (515)

References (14)
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  • 2
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    • Lee, K.Y.1
  • 9
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    • H. Lorenz, N. Fahrni, P. Renaud and P. Vettiger, Photoplastic micromechanical components fabricated using optical lithography and sacrificial-layer-lift-off technique. Proc. High Aspect Ratio Micro Structure Technology (HARMST) Forum, Madison, WI, USA, June 1997, pp. 27-28.
    • (1997) Proc. High Aspect Ratio Micro Structure Technology (HARMST) Forum , pp. 27-28
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    • Simple and low cost fabrication of embedded micro-channels by using a new thick-film photoplastic
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    • L.J. Guérin, M. Bossel, M. Demierre, S. Calmes and Ph. Renaud, Simple and low cost fabrication of embedded micro-channels by using a new thick-film photoplastic. Proc. Transducers '97, Chicago, IL, USA, June 1997, Elsevier Science, 1997, pp. 1419-1422.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.