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Volumn 82, Issue 2, 2005, Pages 129-135
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Profile control in high aspect ratio contact hole etching by a capacitively coupled plasma source
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Author keywords
Capacitively coupled plasma; Contact hole etching; High aspect ratio; Vertical profile
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Indexed keywords
ASPECT RATIO;
EMISSION SPECTROSCOPY;
EXTRACTION;
MASKS;
PHOTORESISTS;
POLYMERS;
POLYSILICON;
CAPACITIVELY COUPLED PLASMA;
CONTACT HOLE ETCHING;
HIGH ASPECT RATIO;
VERTICAL PROFILES;
PLASMA ETCHING;
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EID: 25444531737
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2005.07.001 Document Type: Article |
Times cited : (7)
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References (8)
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