Fabrication of high-aspect-ratio microstructures using SU8 photoresist

Microsystem Technologies

Volumn 11, Issue 4-5, 2005, Pages 343-346

  Liu, G ^a   Tian, Y ^a   Kan, Y ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIFFUSION; LITHOGRAPHY; MICROSTRUCTURE; ORGANIC SOLVENTS; SYNTHESIS (CHEMICAL); THICK FILMS; ULTRAVIOLET RADIATION;

DIFFUSION PROCESS; FILM THICKNESS; SOFT BAKE; SU8 PHOTORESISTS;

PHOTORESISTS;

EID: 21044436903     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0452-x     Document Type: Conference Paper

References (5)

1. LaBianca N; Delorme J (1995) High aspect ratio resist for thick film applications. In: Proceedings of SPIE 2438: pp. 846-852
2. Lorenz H; Despont M; Fahrni M; LaBianca N; Vettiger P; Renaud P (1997) SU-8: a low-cost negative resist for MEMS. J Micromech Microeng 7: 121-124
3. Zhong-geng Ling; Run Lian; Linke Jian (2000) Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters. In: Proceedings of SPIE 3999: 1019-1027
4. Zhang J; Tan KL; Hong GD; Yang LJ; Gong HQ (2001) Polymerization optimization of SU-8 resist and its applications in microfluidic systems and MEMS. J Micromech Microeng 8: 20-26
5. Ma DZ; He PS; Xu ZD; Zhou QQ (1995) Structures and properties of polymer, 2nd edn. vol 4, Science press, Beijing