Novel positive-tone thick photoresist for high aspect ratio microsystem technology

Microsystem Technologies

Volumn 8, Issue 4-5, 2002, Pages 326-329

  Hsieh, G W ^a   Hsieh, Y S ^a   Yang, C R ^b   Lee, Y D ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPOLYMERS; CROSSLINKING; ELECTROFORMING; MICROSTRUCTURE; SYNCHROTRON RADIATION;

MICROSYSTEM TECHNOLOGY;

PHOTORESISTS;

EID: 0036694019     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-001-0158-2     Document Type: Conference Paper

References (6)

1. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic molding (LIGA process)
2. Galvanoplated 3D Structures for Micro Systems
3. The formation of moulds for 3D microstructures using excimer laser ablation
4. SU-8: A low-cost negative resist for MEMS
5. Dependence of the quality of thick resist structures on resist baking