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Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 590-597

A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist

(4) Lin, Che Hsin a Lee, Gwo Bin a Chang, Bao Wen a Chang, Guan Liang a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKING (CHEMICAL); LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; PHOTORESISTS; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE;

CONSTANT VOLUME INJECTION METHOD; EDGE BEAD EFFECT; HARD BAKING PROCESS; MICROFLUIDIC DEVICES; MICRONOZZLE; PHOTOMASKS; SOFT BAKING PROCESS; THRUSTER; ULTRA DEEP TRENCHES; ULTRATHICK MICROFLUIDIC MICROSTRUCTURES;

MICROELECTRONIC PROCESSING;

EID: 0036734816 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/12/5/312 Document Type: Article

Times cited : (265)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.