Electrodeposition of Ni in Submicrometer Trenches

Journal of the Electrochemical Society

Volumn 154, Issue 9, 2007, Pages

  Kim, S K ^a,b   Bonevich, J E ^a   Josell, D ^a   Moffat, T P ^a,c  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Korea Institute of Science and Technology   (South Korea)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CETYL-TRIMETHYL-AMMONIUM (CTA+); POLYETHYLENEIMINE (PEI); SUBMICROMETER TRENCHES; VOID-FREE FILLING;

ELECTRODEPOSITION; ELECTROLYTES; NICKEL COMPOUNDS; VOLTAMMETRY;

SURFACE ACTIVE AGENTS;

EID: 34547519443     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2749188     Document Type: Article

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