Effect of electrolyte acidity on copper plating process performance

ECS Transactions

Volumn 2, Issue 6, 2006, Pages 107-115

  Witt, C ^a   Srinivasan, J ^a   Lin, X ^a   Carpio, R ^b  

^a Cookson Electronics ^*  (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDITY; ELECTROLYTES; ELECTROPLATING; GROWTH RATE; MASS TRANSFER; SULFURIC ACID;

CHONOPOTENTIOMETRY; ELECTROLYTE ACIDITY; SEMICONDUCTOR INTERCONNECT FABRICATION;

COPPER PLATING;

EID: 34547507086     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2408868     Document Type: Conference Paper

References (14)