Effects of saccharin and thiourea on sulfur inclusion and coercivity of electroplated soft magnetic CoNiFe film

Journal of the Electrochemical Society

Volumn 146, Issue 9, 1999, Pages 3295-3299

  Osaka, Tetsuya ^a   Sawaguchi, Takahiro ^b   Mizutani, Fumio ^b   Yokoshima, Tokihiko ^a   Takai, Madoka ^a   Okinaka, Yutaka ^a  

^a WASEDA UNIVERSITY   (Japan)

^b NATL INST BIOSCI HUM TECHNOL   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHEMISORPTION; COBALT ALLOYS; COERCIVE FORCE; ELECTROPLATING; INCLUSIONS; NICKEL PLATING; NITROGEN COMPOUNDS; SCANNING TUNNELING MICROSCOPY; SOFT MAGNETIC MATERIALS; SULFUR COMPOUNDS;

SACCHARIN; THIOUREA;

MAGNETIC FILMS;

EID: 0033366012     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1392470     Document Type: Article

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