Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Microelectronics Journal

Volumn 38, Issue 4-5, 2007, Pages 463-473

  Alam, Syed M ^a   Gan, Chee Lip ^b   Thompson, Carl V ^c   Troxel, Donald E ^c  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Aluminum (AL) interconnects; Computer aided design (CAD); Copper (Cu) interconnects; Electromigration; Reliability; Thermal analysis

Indexed keywords

COMPUTER AIDED DESIGN; ELECTRIC POWER SYSTEM INTERCONNECTION; INTEGRATED CIRCUIT LAYOUT; MATERIALS SCIENCE; METALLIZING; MICROPROCESSOR CHIPS; RELIABILITY THEORY;

ALUMINUM (AL) INTERCONNECTS; COPPER (CU) INTERCONNECTS; DUAL-DAMASCENE INTERCONNECT SYSTEMS; ELECTROMIGRATION FAILURE;

ELECTROMIGRATION;

EID: 34249315774     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.11.017     Document Type: Article

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