Thermal aware cell-based full-chip electromigration reliability analysis

Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI

Volumn , Issue , 2005, Pages 26-31

  Alam, Syed M ^a   Troxel, Donald E ^b   Thompson, Carl V ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b Massachusetts Institute of Technology   (United States)

Author keywords

Electromigration; Full chip reliability; IC thermal analysis; Reliability aware design; Reliability characterization

Indexed keywords

COMPUTER AIDED DESIGN; DATA REDUCTION; ELECTROMIGRATION; FAST FOURIER TRANSFORMS; THERMOANALYSIS;

FULL-CHIP RELIABILITY; IC THERMAL ANALYSIS; RELIABILITY AWARE DESIGN; RELIABILITY CHARACTERIZATION;

INTEGRATED CIRCUIT LAYOUT;

EID: 29244484305     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1057661.1057670     Document Type: Conference Paper

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