Reliability analysis for encapsulated interconnect lines under dc and pulsed dc current using a continuum electromigration transport model

Journal of Applied Physics

Volumn 82, Issue 12, 1997, Pages 5991-6000

  Clement, J J ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001598176     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.366464     Document Type: Article

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