Electromigration lifetime enhancement for lines with multiple branches

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2000, Pages 324-332

  Dion, Michael J ^a  

^a INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS; CURRENT DENSITY; ELECTROMIGRATION; FAILURE ANALYSIS; MATHEMATICAL MODELS;

SEMICONDUCTOR INTERCONNECT SYSTEMS;

INTEGRATED CIRCUITS;

EID: 0033742028     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)