Thermal analysis of vertically integrated circuits

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1995, Pages 487-490

  Kleiner, Michael B ^a   Kuehn, Stefan A ^a   Ramm, Peter ^a   Weber, Werner ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC HEATING; INTEGRATED CIRCUIT MANUFACTURE; MOSFET DEVICES; SEMICONDUCTING SILICON; THERMOANALYSIS; THREE DIMENSIONAL;

ONE DIMENSIONAL; THERMAL COUPLING; THICKNESS EFFECTS; VERTICALLY INTEGRATED CIRCUITS;

INTEGRATED CIRCUITS;

EID: 0029491614     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)