Impact of Self-Heating on Digital SOI and Strained-Silicon CMOS Circuits

IEEE International SOI Conference

Volumn , Issue , 2003, Pages 161-163

  Jenkins, K A ^a   Franch, R L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; HEAT RESISTANCE; SILICON ON INSULATOR TECHNOLOGY;

DRAIN CURRENT;

CMOS INTEGRATED CIRCUITS;

EID: 0142217023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/soi.2003.1242936     Document Type: Conference Paper

References (9)

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4. Nakayama, H. et al, IEEE 2000 CICC, pp. 381-384
5. Tenbroek, B. et al, JSSC 33, pp. 1037-1046 (1998)
6. Polonsky, S.,private communication
7. Sinha, S.P. et al, IEEE 2001 SOI Coherence, pp. 101-102
8. Joshi, R.V. et al, SISP AD2001, pp. 242-245
9. Asseghi, M. et al, IEEE 2002 SOI Conference, pp. 51-52