Diffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects

Applied Physics Letters

Volumn 74, Issue 1, 1999, Pages 37-39

  Srikar, V T ^a   Thompson, C V ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002090122     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.123125     Document Type: Article

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