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Volumn 2005, Issue , 2005, Pages 29-38

Engineering wafers for the nanotechnology era

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; LEAKAGE CURRENTS; LOGIC DESIGN; MOSFET DEVICES; NANOTECHNOLOGY; OPTIMIZATION;

EID: 33751421996     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDER.2005.1546579     Document Type: Conference Paper
Times cited : (21)

References (64)
  • 2
    • 33646206883 scopus 로고    scopus 로고
    • Silicon-on-insulator technology and devices XI
    • C. Mazure, Silicon-on-Insulator Technology and Devices XI, ECS Proc., Vol. 2003-05, (2003), p. 13.
    • (2003) ECS Proc. , vol.2003 , Issue.5 , pp. 13
    • Mazure, C.1
  • 24
    • 12744267605 scopus 로고    scopus 로고
    • Semiconductor wafer bonding VII: Science, technology and applications
    • B. Ghyselen, Semiconductor Wafer Bonding VII: Science, Technology and Applications, ECS Vol. 2003-19, 96 (2003).
    • (2003) ECS , vol.2003 , Issue.19 , pp. 96
    • Ghyselen, B.1
  • 46
    • 33751418849 scopus 로고    scopus 로고
    • A. Boussagol, private communication
    • A. Boussagol, private communication.
  • 64
    • 0033905552 scopus 로고    scopus 로고
    • Solid State Materials for Advanced Technology
    • F. Fournel and al, Mat. Sci. & Eng. B, Solid State Materials for Advanced Technology, B73 (1-3), 42-46 (2000).
    • (2000) Mat. Sci. & Eng. B , vol.B73 , Issue.1-3 , pp. 42-46
    • Fournel, F.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.