300 mm ultra thin SOI material using Smart-Cut® technology

IEEE International SOI Conference

Volumn , Issue , 2002, Pages 1-5

  Auberton Herve A J ^a   Maleville, C ^a  

^a PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

SEMICONDUCTING FILMS; SILICON WAFERS; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY; ULTRATHIN FILMS;

SMART-CUT TECHNOLOGY;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0036456606     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. www.soisolutions.com/news.html.
2. http://public.itrs.net.
3. C. Maleville et al., 2001 IEEE SOI conference, p. 155.