Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

Journal of Materials Science: Materials in Electronics

Volumn 17, Issue 11, 2006, Pages 943-950

  Wu, B Y ^a   Zhong, H W ^a   Chan, Y C ^a   Alam, M O ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; ELECTROMIGRATION; ELECTRONICS PACKAGING; SEMICONDUCTING INTERMETALLICS; STRENGTH OF MATERIALS; TEMPERATURE MEASUREMENT; THERMAL STRESS;

BALL GRID ARRAY (BGA); JOULE HEATING; MECHANICAL STRENGTH TEST; MICROSTRUCTURAL ANALYSIS;

SOLDERING ALLOYS;

EID: 33749257270     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-0048-6     Document Type: Article

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