Effects of solid-state annealing on the interfacial intermetallics between tin-lead solders and copper

Journal of Electronic Materials

Volumn 32, Issue 9, 2003, Pages 939-947

  Prakash, Kithva H ^a   Sritharan, Thirumany ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Interface; Intermetallics; Reliability; Solders; X ray diffraction (XRD)

Indexed keywords

ANNEALING; COPPER; INTERFACES (MATERIALS); SOLDERING ALLOYS; TEMPERATURE; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

INTERFACIAL INTERMETALLICS; SOLID-STATE ANNEALING;

INTERMETALLICS;

EID: 0141676007     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0227-7     Document Type: Article

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