Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures

Volumn 41, Issue 9-10, 2004, Pages 2743-2755

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Current stressing; Electromigration; Phase coarsening; Solder joints

Indexed keywords

CURRENT DENSITY; ELECTRIC CURRENTS; EUTECTICS; LEAD; PHASE TRANSITIONS; THERMAL EFFECTS;

JOULE HEATING; PHASE COARSENING; THERMOMIGRATION;

SOLDERED JOINTS;

JOINT; SOLDER;

EID: 1842535999     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2003.12.001     Document Type: Article

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