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Journal of Electronic Materials

Volumn 33, Issue 1, 2004, Pages 22-27

Mechanisms for Interfacial Reactions between Liquid Sn-3.5Ag Solders and Cu Substrates

(5) Chuang, T H a Wu, H M a Cheng, M D a Chang, S Y a Yen, S F a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Intermetallic compounds; Non parabolic growth kinetics; Sn 3.5Ag Cu; Soldering reactions

Indexed keywords

COPPER; DIFFUSION; DISSOLUTION; GROWTH KINETICS; INTERFACIAL ENERGY; INTERMETALLICS; QUARTZ; SOLDERING ALLOYS; THERMAL EFFECTS;

INTERFACIAL REACTION; NON-PARABOLIC GROWTH KINETICS; SN-3.5AG/CU; SOLDERING REACTION;

TIN ALLOYS;

EID: 0742285758 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-004-0289-1 Document Type: Article

Times cited : (27)

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