Microstructural evolution during electromigration in eutectic SnAg solder bumps

Journal of Materials Research

Volumn 20, Issue 9, 2005, Pages 2432-2442

  Chen, Y H ^a   Shao, T L ^a   Liu, P C ^a   Chen, Chih ^a   Chou, T ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; EUTECTICS; FAILURE (MECHANICAL); INTERMETALLICS; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; PHASE TRANSITIONS; TIN ALLOYS;

MICROSTRUCTURAL BUMPS; SOLDER BUMPS; UNDER BUMP METALLIZATION;

SOLDERING ALLOYS;

EID: 29144492880     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0291     Document Type: Article

References (27)

1. K.N. Tu: Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003).
2. K.N. Tu and K. Zeng: Sn-Pb solder reaction in flip chip technology. Mater. Sci. Eng. Rep. R34, 1 (2001).
3. K. Zeng and K.N. Tu: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. Rep. R38, 55 (2002).
4. S. Brandenburg and S. Yeh: Electromigration studies of flip chip bump solder joints. Proceedings of the Surface Mount International Conference and Exhibition, Integrated Electronics Engineering Center (IEEC), San Jose, CA (1998). p. 337.
5. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu: Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. Appl. Phys. Lett. 75, 58 (1999).
6. J.D. Wu, P.J. Zheng, K. Lee, C.T. Chiu, and J.J. Lee: Electromigration failures of UBM/bump systems of flip-chip packages. Proceedings of the 52nd Electronic Components and Technology Conference, IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA (2002). p. 452.
7. E.C.C. Yeh, W.J. Choi, and K.N. Tu: Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 8(4), 580 (2002).
8. J.W. Nah, K.W. Paik, and J.O. Suh: Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints. J. Appl. Phys. 94(12), 7560 (2003).
9. C.M. Lu, T.L. Shao, and C.J. Yang: Microstructure evolution during electromigration eutectic SnPb solder bumps. J. Mater. Res. 19(8), 2394 (2004).
10. H. Ye, C. Basaran, and D. Hopkins: Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing. Appl. Phys. Lett. 82(7), 1045 (2003).
11. T.Y. Lee, K.N. Tu, and D.R. Frear: Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip-chip solder bumps and under-bump metallization. J. Appl. Phys. 90(9), 4502 (2001).
12. S.Y. Jang, J. Wolf, W.S. Kwon, and K.W. Paik: UBM (under bump metallization) study for Pb-free electroplating bumping: Interface reaction, and electromigration. Electronic Components and Technology Conference, Packaging, and Manufacturing Technology Society, IEEE Components, IEEE, San Diego, CA (2002). p. 1213. Society, IEEE Components, IEEE, San Diego, CA
13. W.J. Choi, E.C.C. Yeh, and K.N. Tu: Mean-time-to-failure study of flip-chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization. J. Appl. Phys. 94(9), 5665 (2003).
14. T.L. Shao, Y.H. Chen, S.H. Chiu, and C. Chen: Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads. J. Appl. Phys. 96(8), 4518 (2004).
15. S.W. Chen, C.M. Chen, and W.C. Liu: Electric current effects upon the Sn/ Cu and Sn/Ni interfacial reactions. J. Electron. Mater. 27(11), 1193 (1998).
16. S.J. Wang and C.Y. Liu: Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure. J. Electron. Mater. 32(11), 1303 (2003).
17. T.L. Shao, T.S. Chen, Y.M. Huang, and C. Chen: Cross interactions on interfacial reactions of solder bumps and metallization layers during reflow. J. Mater. Res. 19(12), 3654 (2004).
18. P.G. Kim, J.W. Jang, T.Y. Lee, and K.N. Tu: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86(12), 6746 (1999),
19. K.N. Tu: Interdiffusion and reaction in bimetallic Cu-Sn thin films. Acta Metall. 21(4), 347 (1973).
20. J.W. Mayer, J.M. Poate, and K.N. Tu: Thin films and solid-phase reactions. Science 190, 228 (1975).
21. K.N. Tu and R.D. Thompson: Kinetics of interfacial reaction in bimetallic Cu-Sn thin films. Acta Mater. 30, 947 (1982).
22. H. Mehrer: Reference Database for Diffusivities, Landolt-Börnstein New Series (Springer, Berlin, 1990), Group III, Vol. 26.
23. K. Zeng and J. Kivilahti: Thermodynamic Calculation of Saturation Solubilities of Some Metals in Pb-Free Solders. Internal Report (Helsinki University of Technology, Helsinki, Finland, 2000).
24. W.T. Chen, C.E. Ho, and C.R. Kao: Effect of concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 17(2), 263 (2002).
25. S.N. Mei, J. Shi, and H.B. Huntington: Diffusion and electromigration in lead alloys. I. Nickel as a mobile element. J. Appl. Phys. 62(2), 444 (1987).
26. C.S. Huang, J.G. Duh, and Y.M. Chen: Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package. J. Electron. Mater. 32(12), 1509 (2003).
27. K.N. Tu, C.C. Yeh, and C.Y. Liu: Effect of current crowding on vacancy diffusion and void formation in electromigration. Appl. Phys. Lett. 76(8), 988 (2000).