Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Journal of Materials Research

Volumn 20, Issue 8, 2005, Pages 2184-2193

  Liu, Yeh Hsiu ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTROMIGRATION; EUTECTICS; FLIP CHIP DEVICES; METALLIZING; SOLDERED JOINTS; THIN FILMS; VANADIUM;

ELECTROMIGRATION BEHAVIOR; ELECTRON PROBE MICROANALYZER (EPMA); SOLDER BUMPS; UNDERBUMP METALLIZATION (UBM);

LEAD ALLOYS;

EID: 28844484176     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0271     Document Type: Article

References (27)

1. The International Technology Roadmap for Semiconductor: 1999.
2. D.O. Powell and A.K. Trivedi: Flip-chip on FR-4 integrated circuit packaging, in Proc. 43rd Electronic Components and Technology Conference (IEEE Components, Packaging and Manufacturing Technology Society, Orlando, FL, 1993), pp. 182-186.
3. J.H. Lau: Ball Grid Array Technology (McGraw-Hill, New York, 1995).
4. R. Mahajan, K. Brown, and V. Atluri: The evolution of microprocessor packaging. Intel Technol J. Q3 (2000).
5. S. Brandenberg and S. Yeh: Electromigration studies of flip chip bump solder joints, in Surface Mount International Conference and Exposition, SMI 98 Proceedings (1998), p. 337.
6. T.Y. Lee, K.N. Tu, and D.F. Frear: Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization. J. Appl. Phys. 90, 4502 (2001).
7. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu: Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. Appl. Phys. Lett. 75, 58 (1999).
8. W.J. Choi, E.C.C. Yeh, and K.N. Tu: Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization, in Proc. 52nd Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2002), p. 1201.
9. T.Y. Lee, K.N. Tu, S.M. Kuo, and D.R. Frear: Electromigration of eutectic SnPb solder interconnects for flip chip technology. J. Appl. Phys. 89, 3189 (2001).
10. J.W. Nah, K.W. Paik, J.O. Suh, and K.N. Tu: Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joint. J. Appl. Phys. 94, 7560 (2003).
11. D. Gupta, K. Vieregge, and W. Gust: Interface diffusion in eutectic Pb-Sn solder. Acta Mater. 47, 5 (1999).
12. H.B. Huntington and A.R. Grone: Current-induced marker motion in gold wires. J. Phys. Chem. Solids 20, 76 (1961).
13. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan: Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 80, 580 (2002).
14. Y.H. Liu, C.M. Chuang, and K.L. Lin: Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test. J. Mater. Res. 19, 2471 (2004).
15. 3Sn intermetallic on the reaction of Cu with 95Pb-5Sn solder. J. Electron. Mater. 15, 355 (1986).
16. H.K. Kim and K.N. Tu: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996).
17. M. Hansen and K. Anderko: Constitution of Binary Alloys, 2nd ed. (GP Publishing Co., Schenectady, NY, 1985).
18. A. Zribi, A. Clark, L. Zavalij, P. Borgesen, and E.J. Cotts: The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure. J. Electron. Mater. 30, 1157 (2001).
19. L.Y. Park, C.W. Yang, J.S. Ha, C.U. Kim, E.J. Kwon, S.B. Jung, and C.S. Kang: Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization. J. Electron. Mater. 30, 1165 (2001).
20. K. Zeng, V. Vuorinen, and J.K. Kivilahti: Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs, in Proceedings of 51st Electronic Component & Technology Conference (IEEE, Piscataway, NJ, 2001), p. 693.
21. W.T. Chen, C.E. Ho, and C.R. Kao: Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 17, 263 (2002).
22. N.A. Gjostein: In Diffusion, edited by H.I. Aaronson (ASM, Metals Park, OH, 1973), Chap. 9, p. 241.
23. H. Ye, C. Basaran, and D. Hopkins: Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing. Appl. Phys. Lett. 82, 1045 (2003).
24. W.G. Bader: Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in a molten tin-lead solder. Welding J: Res. Suppl. 48, 551s (1969).
25. J.R. Lloyd: Electromigration induced resistance decrease in Sn conductors. J. Appl. Phys. 94, 6483 (2003).
26. F.V. Burckbuchler and C.A. Reynolds: Anisotropy of the residual resistivity of tin with Sb, In, Zn, and Cd impurities, and the ideal resistivities and deviations from Matthiessen's rule at 77 and 273 K. Phys. Rev. 175, 550 (1968).
27. J.A. Rayme and B.S. Chandresekhar: Elastic constant of β tin from 4.2 K to 300 K. Phys. Rev. 120, 1658 (1960).