Capillary force lithography: Fabrication of functional polymer templates as versatile tools for nanolithography

Advanced Functional Materials

Volumn 16, Issue 12, 2006, Pages 1555-1565

  Bruinink, Christiaan M ^a   Péter, Mária ^a   Maury, Pascale A ^a   De Boer, Meint ^a   Kuipers, Laurens ^a,b   Huskens, Jurriaan ^a   Reinhoudt, David N ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b FOM INSTITUTE AMOLF   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; ETCHING; MECHANICAL PROPERTIES; NANOTECHNOLOGY; POLYSTYRENES; THERMOPLASTICS; X RAY PHOTOELECTRON SPECTROSCOPY;

CAPILLARY FORCE LITHOGRAPHY (CFL); NANOIMPRINT LITHOGRAPHY (NIL); REACTIVE ION ETCHING (RIE) TREATMENT; WET ETCHING;

ORGANIC POLYMERS;

EID: 33747610619     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.200500629     Document Type: Article

References (45)

1. S. J. Holmes, P. H. Michel, M. C. Hakey, IBM I. Res. Dev. 1997, 41, 1.
2. J. P. Silverman, J. Vac. Sci. Technol., B 1997, 75, 2117.
3. M. A. McCord, J. Vac. Sci. Technol., B 1997, 75, 2125.
4. U. S. Tandon, Vacuum 1992, 43, 241.
5. Y. Xia, G. M. Whitesides, Angew. Chem. Int. Ed. 1998, 37, 550.
6. S. Y. Chou, P. R. Krauss, P. J. Renstrom, Science 1996, 272, 85.
7. a) J. A. Rogers, K. E. Paul, R. J. Jackman, G. M. Whitesides, Appl. Phys. Lett. 1997, 70, 2658.
8. b) T. W. Odom, V. R. Thalladi, J. C. Love, G. M. Whitesides, J. Am. Chem. Soc. 2002, 124, 12112.
9. K. E. Paul, T. L. Breen, J. Aizenberg, G. M. Whitesides, Appl. Phys. Lett. 1998, 73, 2893.
10. J. C. Love, K. E. Paul, G. M. Whitesides, Adv. Mater. 2001, 13, 604.
11. a) J. Aizenberg, A. J. Black, G. M. Whitesides, Nature 1998, 394, 868.
12. b) A. J. Black, K. E. Paul, J. Aizenberg, G. M. Whitesides, J. Am. Chem. Soc. 1999, 121, 8356.
13. M. Geissler, J. M. McLellan, Y. Xia, Nona Lett. 2005, 5, 31.
14. K. Y. Suh, Y. S. Kim, H. H. Lee, Adv. Mater. 2001, 13, 1386.
15. C. M. Bruinink, M. Pêter, M. de Boer, L. Kuipers, J. Huskens, D. N. Reinhoudt, Adv. Mater. 2004, 16, 1086.
16. K. Y. Suh, H. H. Lee, Adv. Funct. Mater. 2002, 12, 405.
17. For information on the effect of curing conditions on the material properties of PDMS stamps, see http://www.zurich.ibm.com/st/microcontact/stamps/ material.html (accessed September 2005).
18. K. Y. Suh, J. Park, H. H. Lee, J. Chem. Phys. 2002, 116, 7714.
19. K. Y. Suh, P. Kim, H. H. Lee, Appl Phys. Lett. 2004, 85, 4019.
20. K. Y. Suh, S. Chu, H. H. Lee, J. Micromech. Microeng. 2005, 14, 1185.
21. K. Y. Suh, P. J. Yoo, H. H. Lee, Macromolecules 2002, 35, 4414.
22. M. Wissen, H. Schnltz, N. Bogdanski, H.-C. Scheer, Y. Hirai, H. Kikuta, G. Ahrens, F. Reuther, K. Pfeiffer, Microelectron. Eng. 2004, 73, 184.
23. R. W. Jaszewski, H. Schift, B. Schnyder, A. Schneuwly, P. Gröning, Appl. Surf. Sci. 1999, 143, 301.
24. M. Bender, M. Otto, B. Hadam, B Spangenberg, H. Kurz, Microelectron. Eng. 2002, 67, 407.
25. The presence of fluorine-containing additives that are well known for lowering the surface energy of any surface was excluded by XPS analysis of mr-L6000. Although no specific elements were detected by XPS analysis that could confirm the presence of other types of surfactants in this commercial resist, the product specifications confirm the use of such additives in mr-L6000 (i.e., "surface smoothers") in order to increase the surface smoothness of resist layers in spin-coating. Furthermore, the low pattern density can account in part for the excellent properties of the cured mr-L6000 templates as NIL molds.
26. B. Faircloth, H. Rohrs, R. Tiberio, R. Ruoff, R. R. Krchnavek, J. Vac. Sci. Technol., B 2000, 18, 1866.
27. Y. Xia, X.-M. Zhao, E. Kim, G. M. Whitesides, Chem. Mater. 1995, 7, 2332.
28. S. Y. Chou, P. R. Krauss, W. Zhang, L. Guo, L. Zhuang, J. Vac. Sci. Technol., B 1997, 15, 2897.
29. I. Manners, Chem. Commun. 1999, 857.
30. I. Korczagin, S. Golze, M. A. Hempenius, G. J. Vancso, Chem. Mater. 2003, 75, 3663.
31. R. D. Miller, G. M. Wallraff, Adv. Mater. Opt. Electron. 1994, 4, 95.
32. G. Beamson, D. Briggs, High Resolution XPS of Organic Polymers: The Scienta ESCA300 Database, John Wiley & Sons, Chichester, UK 1992.
33. -1).
34. K. Glasmäster, J. Gold, A.-S. Andersson, D. S. Sutherland, B. Kasemo, Langmuir 2003, 19, 5475.
35. H. Gokan, Y. Saotome, K. Saigo, F. Watanabe, Y. Ohnishi, in Polymers for High Technology, Electronics, and Photonics (Eds: S. R. Turner, M. J. Bowden), ACS Symposium Series, American Chemical Society, Washington, DC 1986, pp. 358-368.
36. J. F. Moulder, W. F. Stickle, P. E. Sobol, K. Bomben, Handbook of X-ray Photoelectron Spectroscopy (Ed: J. Chastain), Perkin-Ehner Corporation, Eden Prairie, MN1992.
37. V. Z.-H. Chan, E. L. Thomas, J. Frommer, D. Sampson, R. Campbell, D. Miller, C. Hawker, V. Lee, R. D. Miller, Chem. Mater. 1998, 10, 3895.
38. W. Kern, C. A. Decken, in Thin Film Processes II (Eds: J. L. Vossen, W. Kern), Academic, Boston, MA 1978.
39. At these dimensions, the standard deviation (a) in the line width of the gold rings is ca. 30 nm: about 50 % of the ring in Figure 9c (and Fig. 10e for close-up SEM image) has lateral dimensions in the sub100 nm range (> 70 nm).
40. At these dimensions, the grain size of the metal layer is known to affect the ultimate resolution. For our gold layers, a grain size distribution of 30-60 nm was determined by AFM.
41. K. Y. Suh, H. H. Lee, Adv. Mater. 2002, 14, 346.
42. C. Luo, R. Xing, Y. Han, Surf. Sci 2004, 552, 139.
43. K. Y. Suh, H. H. Lee, J. Micromech. Microeng. 2005, 15, 400.
44. H. Schmid, B. Michel, Macromolecules 2000, 33, 3042.
45. H. Ron, I. Rubinstein, Langmuir 1994, 10, 4566.