UV curing of resists for warm embossing

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 184-189

  Wissen, M ^a   Schulz, H ^a   Bogdanski, N ^a   Scheer, H C ^a   Hirai, Y ^b   Kikuta, H ^b   Ahrens, G ^c   Reuther, F ^c   Pfeiffer, K ^c  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b Osaka Prefecture University   (Japan)

^c MICRO RESIST TECHNOLOGY GMBH   (Germany)

Author keywords

Nanoimprint lithography; UV curing; Warm embossing

Indexed keywords

GLASS TRANSITION; LOW TEMPERATURE EFFECTS; OPTIMIZATION; PHOTORESISTS; POLYMERS; THERMAL EFFECTS; THERMODYNAMIC STABILITY; ULTRAVIOLET RADIATION;

NANOIMPRINT LITHOGRAPHY; PHOTOMASKS; UV CURING; WARM EMBOSSING;

CURING;

EID: 17344376280     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00096-6     Document Type: Conference Paper

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